Materials Science and Engineering Seminar

April 24-25, 2013
9am – 5pm
Ascott, Makati City

Fee: Php 15,000.00 / person plus 12% VAT

• Early Registration Payment: Ten-Percent (10%) Discount if  PAID thirty (30) days before the training date
• Group Discount: Five-Percent (5%) on Three (3) or More Participants

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SYNOPSIS

The course is an introductory course on engineering materials, which due with science, technology, design, and application of typical materials for engineering applications. This is an essential technical knowledge for practicing engineers and researchers to improve and modify their respective products as well as solving their materials related issues and failure.

This course is divided into three main parts. The first part includes the classifications of materials that determine their applicability, the structure of the materials explained by the quantum-mechanical principle that relates electrons to energies, bonding scheme of different materials, the structure of crystalline solids and introduction to imperfection in solids. The second part covers the mechanical characteristics of materials for service use and methods of assessing the mechanical characteristics of materials. The second part also includes the behavior of material in thermal equilibrium (free energy concept, phase transformation and examples of phase diagrams), diffusion mechanisms and usual causes of failure in a given material. The third part is on application and processing of specific material (metals, ceramics and polymer). Introduction of electrical, magnetic and optical properties of materials is also presented in the course.

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Objective of the Course:

Upon completion of this course, participants will be able:

• To list the primary classifications of solid materials
• To cite the distinctive chemical features of each class
• To outline the criteria that are important in the materials selection process
• To correlate the structures of a material with its behaviour and performance
• To explain methods of assessing characteristics of materials
• To describe processing techniques of a material for typical applications

Who must attend:

• Technicians, engineers, and researchers
• Decision makers, policy makers, and managers

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Course Outline

• Introduction of materials
• Bonding and properties
• Crystal structure and properties
• Imperfection in solid
• Diffusion
• Mechanical properties of metals
• Phase diagram
• Phase transformation
• Processing and application of metals
• Properties, processing and application of ceramics
• Properties, processing and application of polymeric materials
• Properties, processing and application of composite materials
• Failure of materials

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DR CHEONG KUAN YEW

Kuan Yew Cheong was born in Ipoh , Perak (1972) and received the B. Eng (1st Hons.) in Materials Engineering from Universiti Sains Malaysia (USM), Malaysia in 1997. After graduation, he worked for two years as a project engineer and quality assurance engineer in a project management company and a semiconductor-device manufacturing factory in Malaysia.

End of 1999, he decided to pursue his postgraduate study (M.Sc.) after being awarded a Fellowship under the Academic Staff Training Scheme from USM. After completion his M.Sc. in Materials Engineering (Thin Film Technology) in 2001, he continued his Ph.D. in the School of Microelectronic Engineering , Griffith University , Australia and the degree was awarded in 2004. This study was fully sponsored by Australian Research Council, USM, and Griffith University Postgraduate Research Scholarship.

In 2005, he was awarded a Certificate of Teaching and Learning from USM. Now he is serving as an Associate Professor at the School of Materials & Mineral Resources Engineering. He is teaching courses of electronic materials, semiconductor fabrication technology, and quality control and management for more than 6 years at under- and post-graduate levels. Dr. Cheong’s main research area is on semiconductor device fabrication, electronic packaging, and characterization. The outcomes of his research have been published in more than 75 high-impact-factor journals and 3 book chapters. Due to his expertise in wide-bandgap semiconductor-based device fabrication technology, for the past six years, he has been invited three times as a Visiting Scientist to Korea Electrotechnology Research Institute (KERI), Korea.

He has also being invited as an Invited Speaker and Keynote Speaker in International Conference on Electronic Materials 2010 (ICEM 2010) – International Union of Materials Research Societies (IUMRS), Korea, CIE & IEM International Seminar on Electrical, Electronic and Energy Saving 2010, Taiwan, and Infineon Technologies (Kulim) Sdn Bhd (IFKM) Technical Symposium 2010, Malaysia. Recently, he has been invited to deliver a Talk on “Investigating Surface Coating and Corrosion Issues Using Surface Analysis (SA) Tools” in Surface Engineering 2011 at Bangkok , Thailand.

He is also a Professional Engineers in Material Engineering disipline who is registered under Board of Engineers, Malaysia.

Outside university, he is very active in professional and community activities. He is a member of Materials Research Society (USA). He was the honorary treasurer for Electron Microscopy Society , Malaysia for year 2005/2006.

Since 2005, he has been elected as one of the Ex-comms of the Institute of Electrical , Electronic Engineers (IEEE) – Component, Package, and Manufacturing Technology (CPMT) Society and Electron Device Society (EDS), Malaysia Chapter.

In addition, he is also the Chairman of the electronic engineering technical division (eETD) under The Institution of Engineers Malaysia (IEM) since 2009. Recently, he has been appointed as a Council Member of IEM and a Standing Committee on Qualification/Admission and Examination/Training.

For the past years, he has involved in organizing a number of local and international conferences and being invited to chair a few technical sessions in those conferences. He is also closely working with Industry through university-industry linkage program and he is delivering technical training courses for local and multinational electronics industries for the past 5 years and more than 350 engineers and researchers have been benefited from those courses.

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Banco de Oro (BDO)

Account Name: AGUILA GROUP COMPANIES (AGC) DEVELOPMENT CORPORATION

Account Number: (Peso) 00 222 800 0844

Bank Address: East Mansion Townhouse, Elisco Road, Sto Rosario, Pateros

United Coconut Planters Bank (UCPB)

Account Name: AGUILA GROUP COMPANIES (AGC) DEVELOPMENT CORPORATION

Account Number: (Peso) 00-123-002131-3

Bank Address: Aguirre Branch, 114 Pet Bldg., Aguirre St., Legaspi Village, Makati City

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